A B C D E F G H I J K L M N O P Q R S T U V W X Y Z All
M
M.K, Sandhya., Department of Computer Science and Engineering, Meenakshi Sundararajan Engineering College, Chennai, India (India)
Madaan, Jyoti, Manav Rachna International University (India)
Madaci, Mansour, Departement of Electrical Engineering, National Constantine University, Road Ain Elbay (Algeria)
Maddu, Tharun, K.L. University (India)
Madenda, Sarifuddin, Gunadarma University (Indonesia)
Madhu Babu, Thiruveedula, Teegala Krishna Reddy Engineering College (India)
Madona, Putri, Politeknik Caltex Riau (Indonesia)
Maharram, Sultan Huseynova, Institute of Soil Science and Agrochemistry (Azerbaijan)
Mahewar, Ramesh B., Shri Sant Gadge Maharaj College (India)
Mahmood, Nasrul Humaimi, Universiti Teknologi Malaysia (Malaysia)
Mahmuddin, Muchlis, Universitas Sebelas Maret (Indonesia)
Mahsunah, Anis Herliyati, National Research and Inovation Agency (Indonesia)
Mahsusi, Mahsusi, Universitas Islam Negeri Syarif Hidayatullah Jakarta (Indonesia)
Majumdar, Sarangam, National Institute of Technology, Rourkela (India)
Majumdar, Sarangam, National Institute of Technology (India)
Majumdar, Sarangam
Malik, Rio Andika, University of Perintis Indonesia (Indonesia)
Mallick, Ranjan Kumar, Siksha ‘O’ Anusandhan Deemed to be University (India)
Mallika, S., Department of Electrical and Electroncis Engineering, Sri Sairam Engineering College, Chennai (India)
Mami, Abdelkader, Université de Tunis El Manar (Tunisia)
Mamun, Al, Northern University of Business and Technology Khulna (Bangladesh)
Manafova, Arzu Manaf, Institute of Soil Science and Agrochemistry (Azerbaijan)
Mandala, Rila, President University (Indonesia)
Mandour, M., University of Benha (Egypt)
626 - 650 of 1216 Items << < 21 22 23 24 25 26 27 28 29 30 > >>
International Journal of Advances in Applied Sciences (IJAAS)
p-ISSN 2252-8814, e-ISSN 2722-2594
This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.