Miniaturized circular fractal patch antenna with defected ground structure for high-selectivity dual-band X-band applications

Raju Thommandru, Rengaraj Saravanakumar

Abstract


Microstrip patch antennas are easily fabricated and have a low profile, making them widely used in radar, satellite, and defence applications. Achieving high selectivity and miniaturization in X-band dual-band operation remains a challenge. Conventional designs using simple patch geometries and defected ground structures (DGS) often exhibit limited bandwidth, poor impedance matching, and reduced gain. To address these limitations, this work presents a miniaturized circular fractal patch antenna with an optimized DGS to enhance frequency selectivity, improve impedance matching, and maintain compact size. Circular fractal slots are introduced in the radiating patch to extend the effective current path while preserving the footprint. A centrally placed diamond-shaped slot provides capacitive loading that aids impedance tuning. Electromagnetic simulations were conducted in Ansys HFSS 2023 R2, and a prototype was fabricated on an FR-4 substrate with εr = 4.4, loss tangent = 0.02, and thickness 1.6mm. Measurements verify two passbands: 8.637–9.173GHz (center 8.8025GHz, return loss −22.0267dB, voltage standing wave ratio (VSWR) 1.1720, gain 4.82dB, efficiency 63.51%) and 10.121–10.956GHz (center 10.3700GHz, return loss −25.2864dB, VSWR 1.1199, gain 3.42dB, efficiency 72.58%). The antenna shows steady radiation and improved matching across both bands, supporting use in compact X-band front ends.

Full Text:

PDF


DOI: http://doi.org/10.11591/ijaas.v15.i1.pp372-383

Refbacks

  • There are currently no refbacks.


Copyright (c) 2026 Raju Thommandru, Rengaraj Saravanakumar

Creative Commons License
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

View the IJAAS Visitor Statistics

International Journal of Advances in Applied Sciences (IJAAS)
p-ISSN 2252-8814, e-ISSN 2722-2594
This journal is published by Intelektual Pustaka Media Utama (IPMU) in collaboration with the Institute of Advanced Engineering and Science (IAES).